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Logitech PLJ Precision Lapping Jigs are used to hold multiple “wafer geometry” or slide mounted specimens, while they are being processed on a Logitech precision lapping machine. -
The CB30 Bonding Unit and CH30 Hotplate compliment the Compact 50 Thin Section Preparation System. The bonding unit and hotplate are ideal for research or education purposes. -
The production of thin and ultra thin sections of materials requires the sample material to be fixed to a substrate （e.g. glass microscope slide） for support during processing. -
For easily achievable impregnation results, the CitoVac provides superior capabilities and trouble-free operation. Its spacious vacuum chamber and clear, user-friendly display offers great ease of use
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